| 发明名称 |
Method for selectively plating an organic substrate |
| 摘要 |
The present invention relates to a process for metallizing features of an electronic component, where the metallized features, conductive pads, conductive traces, are coated and encapsulated with at least one metal layer and the features on the front side and the back side of the component have different thicknesses |
| 申请公布号 |
AU5426998(A) |
申请公布日期 |
1998.05.29 |
| 申请号 |
AU19980054269 |
申请日期 |
1997.10.30 |
| 申请人 |
W.L. GORE + ASSOCIATES INC. |
发明人 |
RANDY E. HASLOW;DONALD G. HUTCHINS;MICHAEL R. LEAF |
| 分类号 |
H05K1/02;H05K3/06;H05K3/10;H05K3/24;H05K3/34;H05K3/42 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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