发明名称 Semiconductor structures and methods for fabricating semiconductor structures comprising high dielectric constant stacked structures
摘要 Semiconductor structures, and methods for fabricating semiconductor structures, comprising high dielectric constant stacked structures are provided. A stacked dielectric structure ( 16 ) in accordance with one exemplary embodiment of the present invention has a first amorphous dielectric layer ( 18 ) comprising Hf<SUB>X</SUB>Zr<SUB>1-X</SUB>O<SUB>2</SUB>, where 0<=X<=1. An amorphous interlayer ( 20 ) overlies the first amorphous dielectric layer. The interlayer has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO<SUB>4</SUB>. A second amorphous dielectric layer ( 22 ) overlies the interlayer. The second amorphous dielectric layer comprises Hf<SUB>Y</SUB>Zr<SUB>1-Y</SUB>O<SUB>2</SUB>, where 0<=Y<=1. The stacked dielectric structure ( 16 ) has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO<SUB>4</SUB>.
申请公布号 US7217643(B2) 申请公布日期 2007.05.15
申请号 US20050066887 申请日期 2005.02.24
申请人 FREESCALE SEMICONDUCTORS, INC. 发明人 LIANG YONG;LI HAO
分类号 H01L21/3205 主分类号 H01L21/3205
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