摘要 |
Semiconductor structures, and methods for fabricating semiconductor structures, comprising high dielectric constant stacked structures are provided. A stacked dielectric structure ( 16 ) in accordance with one exemplary embodiment of the present invention has a first amorphous dielectric layer ( 18 ) comprising Hf<SUB>X</SUB>Zr<SUB>1-X</SUB>O<SUB>2</SUB>, where 0<=X<=1. An amorphous interlayer ( 20 ) overlies the first amorphous dielectric layer. The interlayer has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO<SUB>4</SUB>. A second amorphous dielectric layer ( 22 ) overlies the interlayer. The second amorphous dielectric layer comprises Hf<SUB>Y</SUB>Zr<SUB>1-Y</SUB>O<SUB>2</SUB>, where 0<=Y<=1. The stacked dielectric structure ( 16 ) has a net dielectric constant that is approximately no less than the dielectric constant of HfZrO<SUB>4</SUB>.
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