发明名称 Stamping machine for mounting retention frame of heat sink to motherboard
摘要 A stamping machine for mounting a retention frame of heat sink ( 510 ) to a motherboard ( 500 ) includes a machine body ( 100 ), an adjusting device ( 200 ), and a controlling unit ( 300 ). The machine body comprises a support plane ( 110 ) and a stamping arm ( 120 ) extending upwardly from the support plane. A plurality of adjusting positioning blocks ( 112 ) is provided on the support plane for fittingly positioning the motherboard. A stamping assembly ( 130 ) is positioned at a forepart of the stamping arm comprises a cylinder ( 140 ), a stamping block ( 150 ) moveably connected to the cylinder, and a base portion ( 114 ) attached on the support plane corresponding to the stamping block. A plurality of stamping posts ( 170 ) extends from the stamping block and a plurality of retractable pressing pins ( 180 ) depends from the stamping block. A resilient member ( 190 ) is disposed around each of the pressing pins.
申请公布号 US7216421(B2) 申请公布日期 2007.05.15
申请号 US20040879580 申请日期 2004.06.28
申请人 HON HAI PRECISION IND. CO., LTD. 发明人 FU JUNLIN
分类号 B23P19/00;H01R4/66;H01R13/648;H05K7/20;H05K13/00 主分类号 B23P19/00
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