发明名称 |
Methods of forming capacitor electrodes including a capacitor electrode etch |
摘要 |
A method of forming a capacitor includes the step of forming an electrode on an integrated circuit substrate wherein the electrode covers a first portion of the integrated circuit substrate and wherein the electrode exposes a second portion of the integrated circuit substrate. An etch masking pattern including a plurality of ions is formed on the surface of the electrode wherein the etch masking pattern exposes portions of the surface of the electrode. The exposed portions of the electrode are etched using the etch masking pattern as an etching mask so that recesses are formed in the surface of the electrode thereby increasing a surface area thereof. The etch masking pattern is removed, a dielectric layer is formed on the electrode including the recesses, and a conductive layer is formed on the dielectric layer opposite the electrode.
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申请公布号 |
US6025248(A) |
申请公布日期 |
2000.02.15 |
申请号 |
US19970946334 |
申请日期 |
1997.10.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HEE-SEOK;LEE, JAE-CHUL;LIM, HYUN-WOO;LEE, JAE-HYONG |
分类号 |
H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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