Apparatus and method for use in manufacturing semiconductor devices
摘要
An apparatus for use in manufacturing a semiconductor device includes an input-output (IO) face having a plurality of IO lands, and is situated in an operating position in abutting relation with a depositor. The apparatus includes a first holding member holding the depositor in a first position; a second holding member holding the semiconductor device in the operating position. The depositor and the semiconductor device cooperate in the operating position to deposit solder ball connection structures to the IO lands. The apparatus further includes a separating member for moving at least one of the depositor and the semiconductor device from the operating position to an interim orientation. The interim orientation establishes a separation distance intermediate the depositor and the semiconductor device appropriate to disengage the solder ball connecting structures from the depositor.
申请公布号
US6149048(A)
申请公布日期
2000.11.21
申请号
US19980057421
申请日期
1998.04.08
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BREARLEY, WILLIAM;ECONOMIKOS, LAERTIS;FINDEIS, PAUL F.;KELLY, KIMBERLEY A.;LEENSTRA, BOUWE W.;MERRYMAN, ARTHUR GILMAN;PERFECTO, ERIC DANIEL;PRASAD, CHANDRIKA;WOOD, JAMES PATRICK;YU, ROY