| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having very superior sensitivity, adhesion, chemical resistance, flexibility and contamination property with respect to a plating bath, and to provide a method for producing a printed wiring board using the composition. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound, having at least one polymerizable ethylenically unsaturated group in one molecule and (C1) a coumarin derivative of formula (I) and (C2) a boron salt compound of formula (II) as (C) a photopolymerization initiator system. The photosensitive resin composition is applied and dried on a base and a protective film is optionally disposed, to obtain the objective photosensitive element. The photosensitive element is sued in the method for producing a printed wiring board. |
