| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly method and apparatus which enable the assembly of small-sized surface mounted electronic components without causing any variations in resistance values. SOLUTION: An assembly apparatus 1 for surface mount electronic components attaches a quartz-crystal strip as an electronic component element to an electrode 5 on a package 2. The assembly apparatus 1 is provided with a contact sensor 31 to measure a distance LZ between an injection tube 30 for spouting adhesives, a nozzle 29 for sucking the quartz-crystal strip and the front surface 4a on a bottom wall 4. The front surface 4a on the bottom wall 4 is previously fixed to a position relative to the electrode 5. The assembly apparatus 1 measures the distance LZ up to the front surface 4a on the bottom wall 4 using the contact sensor 31. The assembly apparatus 1 coats the electrode 5 with adhesives while locating the injection tube 30 at a position of interval la1 from the electrode 5 depending on the distance LZ. The interval la1 represents a distance appropriate for applying adhesives. The assembly apparatus 1 lays the quartz-crystal strip on the adhesives while locating the nozzle 29 sucking the quartz-crystal strip at a position of interval la2 from the electrode 5 depending on the distance LZ. The interval la2 represents another distance appropriate for laying the quartz-crystal strip on the adhesives. COPYRIGHT: (C)2006,JPO&NCIPI
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