| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a polyimide wiring board which is excellent in adhesion between a separated thin metallic film and polyimide, and also excellent in stability with time of the adhesion and, insulation reliability and productivity of the wiring board. SOLUTION: The manufacturing method of the polyimide wiring board includes: a reforming step of treating a polyimide substrate with an alkaline solution; a precious metal ion adsorption step of treating the polyimide substrate with a precious metal ion containing solution; a precious metal ion reduction step of reducing the adsorbed precious metal ions by electromagnetic waves or a reducing agent selected from a group including sodium hypophosphite, dimethyl amine borane, and formic acid; a basic metal ion adsorption step of treating the polyimide substrate with a basic metal ion containing solution; and a basic metal ion reduction step of reducing adsorbed basic metal ions, wherein the basic metal ion reduction step takes place after the precious metal ion reduction step. COPYRIGHT: (C)2008,JPO&INPIT
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