Light emitting device package

摘要

Disclosed is a light emitting device package. The light emitting device package includes a body part provided therein with a cavity, a light emitting chip in the cavity, a cover part to cover the cavity, and a light conversion part provided on a bottom surface of the cover part while being separated from the light emitting chip.

主权项

1. A light emitting device package comprising:
a body part provided therein with a cavity; a light emitting chip in the cavity; a cover part to cover the cavity; a light conversion part provided under a bottom surface of the cover part while being separated from the light emitting chip; an adiabatic layer interposed between the light emitting chip and the light conversion part; a heat radiation part attached to the body part; and a heat transfer layer interposed between the adiabatic layer and the light emitting chip and representing thermal conductivity higher than thermal conductivity of the adiabatic layer.