| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having low elasticity, high heat resistance, and high resolution. <P>SOLUTION: The positive photosensitive resin composition comprises: (A) a polyamic acid; (B) a 1,4-dihydropyridine derivative represented by general formula (II), wherein R<SP>2</SP>represents a monovalent organic group, each of R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>, R<SP>6</SP>independently represents hydrogen or a monovalent organic group, and Ar-NO<SB>2</SB>represents an aromatic hydrocarbon group having a nitro group at the ortho-position; and (C) an amine compound. <P>COPYRIGHT: (C)2007,JPO&INPIT |
