| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moldability and excellent reflow resistance, and an electronic component device comprising an element sealed therewith.SOLUTION: An epoxy resin composition for sealing, comprises (A) epoxy resin, (B) curing agent, (C) curing accelerator, (D) inorganic filler, and (E) silicon containing polymer, where the (E) silicon containing polymer is a polymer having a three-dimensional crosslink, and the (E) silicon containing polymer has a weight average molecular weight of 1500 or more and 7000 or less.SELECTED DRAWING: None |
