发明名称 HEAT TRANSFER INTERFACE
摘要 PROBLEM TO BE SOLVED: To provide a heat transfer interface.SOLUTION: An object of an embodiment of the present invention is to provide a system and method for a thermal management system at temperatures within a range of 120-1,300°C. The present system consists of a variety of thermal transfer chambers configured to include a thermal transfer device which is in a spherical or cylindrical shape or other shapes, and absorbs heat within a wide temperature range and returns such heat of certain temperature for an extended period. The thermal management system includes a plurality of heat transfer particles, which each consist of an inside heat transfer medium charged in an outer container, the outer container being inactive to a heat source and enabling fast acquisition of heat of temperature within the range of 120-1,300°C from the heat source and subsequent dissipation of heat of certain temperature for a certain time.SELECTED DRAWING: Figure 8
申请公布号 JP2016166735(A) 申请公布日期 2016.09.15
申请号 JP20160104883 申请日期 2016.05.26
申请人 SYLVAN SOURCE INC 发明人 EUGENE THIERS
分类号 F28D20/00;F27D17/00;F28D20/02;F28F21/04;F28F21/06;F28F21/08 主分类号 F28D20/00
代理机构 代理人
主权项
地址