| 发明名称 | Power distribution improvement using pseudo-ESR control of an embedded passive capacitor | ||
| 摘要 | A fan-out wafer level package structure may include a multilayer redistribution layer (RDL). The multilayer RDL may be configured to couple with terminals of an embedded capacitor. The multilayer RDL may include sections with fewer layers than other sections of the multilayer RDL according to a selected equivalent series resistance (ESR) control pattern. | ||
| 申请公布号 | US9472425(B2) | 申请公布日期 | 2016.10.18 |
| 申请号 | US201514663342 | 申请日期 | 2015.03.19 |
| 申请人 | QUALCOMM INCORPORATED | 发明人 | Song Young Kyu;Hwang Kyu-Pyung;Lee Jae Sik |
| 分类号 | H01L21/48;H01L23/498;H01L49/02 | 主分类号 | H01L21/48 |
| 代理机构 | Seyfarth Shaw LLP | 代理人 | Seyfarth Shaw LLP |
| 主权项 | 1. A power delivery network, comprising: a fan-out wafer level package structure comprising a multilayer redistribution layer (RDL) configured to couple with terminals of an embedded capacitor, the multilayer RDL comprising sections with fewer layers than other sections of the multilayer RDL according to a selected equivalent series resistance (ESR) control pattern. | ||
| 地址 | San Diego CA US | ||