Systems and methods for stacked semiconductor memory devices

摘要

Systems and methods are provided for stacked semiconductor memory devices. The stacked semiconductor memory devices can include a nonvolatile memory controller, a number of nonvolatile memory dies arranged in a stacked configuration, and a package substrate. The memory controller and the memory dies can be coupled to each other with vias that extend through the package substrate. A vertical interconnect process may be used to electrically connect the nonvolatile memory dies to each other, as well as other system components. The memory controller may be flip-chip bonded to external circuitry, such as another semiconductor device or a printed circuit board.

主权项

1. A semiconductor package, comprising:
a package substrate; a first integrated circuit die having an active side, a back side, and side surfaces that couple the active side to the back side, wherein the first integrated circuit die is embedded in the package substrate, and wherein the package substrate is in direct contact with the back side and side surfaces of the first integrated circuit die; and a second integrated circuit die formed on the package substrate such that the second integrated circuit is in direct contact with the package substrate, wherein the back side of the first integrated circuit die faces the second integrated circuit die, and wherein the first integrated circuit die further includes flip-chip bumps formed at the active side.