Testing of integrated circuit to substrate joints

摘要

A method for testing integrated circuit-to-substrate joints that electrically connect an IC to a substrate. An ammeter is coupled to a test node of the driver IC, while the test node is coupled to a current source, and a measured current output of the ammeter is recorded. A voltmeter is coupled to the test node while the test node is coupled to an end node of a group of dummy IC-to-substrate joints that are daisy chained; a first measured voltage output of the voltmeter is then recorded. The IC then couples the test node to another end node of the daisy chained dummy joints, and a second measured voltage output is recorded. A resistance or admittance value for the electrical connection of the IC to the substrate is then computed, using the first and second measured voltage outputs and the measured current output. Other embodiments are also described and claimed.

主权项

1. A system comprising:
a display panel substrate in which a pixel array region is formed; a driver circuit coupled to drive the pixel array region using signals that are to be transferred between the driver circuit and circuitry external to the driver circuit via a plurality of IC-to-substrate joints formed on the display panel substrate; a plurality of dummy IC-to-substrate joints of the driver circuit that are daisy chained from a first end to a second end; a current source to provide a current; and signal routing means for directly routing the current a) through a test node and not through the daisy chained dummy joints, b) through the daisy chained dummy joints while directly routing the first end of the daisy chained dummy joints to the test node, and c) through the daisy chained dummy joints while directly routing the second end of the daisy chained dummy joints to the test node.