| 摘要 |
An apparatus for automatically mounting chip devices provided in tape units onto a printed circuit board at given positions thereof, said printed circuit board being placed on an XY table movably horizontally in X and Y directions, including a plurality of tape unit mounting units, each supplying chip devices one by one in the upside down fashion, a suction chamber arranged along the tape unit mounting units, a number of carriers each secured to an endless chain and having suction holes such that the suction holes of carriers are always communicated with the inside of the suction chamber, so that a chip device held and sucked on a carrier is fed along the suction chamber into a first transporting position, a turnover device for receiving the chip device at the first transporting position, holding the chip device with the aid of the suction force, turning over the chip device and feeding the chip device into a second transporting position, a mounting head having a suction nozzle receiving and holding the chip device with the aid of the suction force at the second transporting position and mounting the chip device on the printed circuit board. |
