| 摘要 |
PURPOSE:To provide a wire boding device suitable for automation by suppressing the positional change of a capillary. CONSTITUTION:This is equipped with a stage 5, which shifts in forward and backward direction and right and left direction and heats and sucks a semiconductor substrate 6, and a ultrasonic horn 3, where the capillary 2 is attached to the top and which transmits ultrasonics to the semiconductor substrate 6, and this is constituted to send the stage 5 preferentially in the longitudinal direction of the said ultrasonic horn 3, whereby the times that the ultrasonic horn 3 receives heat from the stage 3 are leveled to suppress the thermal expansion. |
