| 摘要 |
An electroless plating deposition speed measuring apparatus is provided with a sensor having an electrode couple whose pair of electrodes are opposed to each other and a sensor drive circuit that cyclically applies voltage to the electrode couple to measure a polarization resistance between the pair of electrodes of the electrode couple. Measuring data from the sensor drive circuit are supplied to a processing circuit. The processing circuit computes and processes the measuring data to find the plating deposition speed. Data of the plating deposition speed from the processing circuit are supplied to a display circuit to display the data of the plating deposition speed. In a preferred embodiment, each of the pair of electrodes of the electrode couple has a conductor and a non-conductor, wherein the surfaces of the conductors and the non-conductors of the respective electrodes are arranged in facing and opposite relation to each other. Each of the conductors is made of a noble-metal material, such as copper, gold, platinum, palladium or the like, while each of the non-conductors is made of an alkaliproof non-conductive material, such as epoxy resin, epoxy resin of a glass base material, or the like.
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