| 摘要 |
PURPOSE:To improve specially the reliability of modification of the circuit of a multilayer interconnection board compared with a conventional method when the modification of the circuit is made. CONSTITUTION:A circuit cutting object part of a connection pattern 8 connecting electrically surface layer patterns 1A, 1B and 1N provided on a surface layer on a basic multilayer interconnection board 30 to each other is first cut off and after that, newly provided surface layer patterns +1A, +1B and 1N and a newly provided connection pattern 18 are formed on the surface layer on this basic multilayer interconnection board 30 via an additional insulating layer 12 according to the need, whereby the modification of a circuit of a multilayer interconnection board 50 is made. |
