| 摘要 |
A package module of an IC device comprises a substrate, at least one semiconductor device, and an interconnected layer. The substrate has a first surface and a second surface, wherein the substrate further contains a plurality of metal plugs, which penetrate the substrate and connect the first surface and the second surface. The semiconductor device is located on the first surface of the substrate, wherein the semiconductor device contains a plurality of metal pads, each of which is connected to one of the metal plugs. The interconnected layer is formed on the second surface of the substrate, wherein the interconnected layer is comprised of a plurality of metal circuits, a plurality of land pads, and a plurality of via pads, wherein each of the metal plugs is connected to one of the metal circuits.
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