发明名称 |
POLYAMIDE RESIN COMPOSITION AND FILM |
摘要 |
PURPOSE: To obtain a film having good melt moldability and excellent gas barrier properties under wide humidity conditions including retorting conditions. CONSTITUTION: The polyamide resin composition comprises a polyamide resin comprising 100-60wt.% aromatic polyamide and 0-40wt.% aliphatic polyamide and a layered silicate having a cation exchange capacity of 30meq/100g or above. The layered silicate should be contained in an amount of 0.01-20wt.% in terms of an ash content, and at least 10% of the silicate should be dispersed at an interlayer distance of 50Åor above.
|
申请公布号 |
JPH08319417(A) |
申请公布日期 |
1996.12.03 |
申请号 |
JP19950128327 |
申请日期 |
1995.05.26 |
申请人 |
MITSUBISHI CHEM CORP |
发明人 |
KAWAI MICHIO;KAWA MANABU;KISHIMOTO SHINTARO |
分类号 |
C08J5/18;C08G69/02;C08G69/04;C08G69/16;C08K3/34;C08K5/04;C08K5/17;C08K5/49;C08K9/02;C08L77/00;(IPC1-7):C08L77/00 |
主分类号 |
C08J5/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|