发明名称 POLYAMIDE RESIN COMPOSITION AND FILM
摘要 PURPOSE: To obtain a film having good melt moldability and excellent gas barrier properties under wide humidity conditions including retorting conditions. CONSTITUTION: The polyamide resin composition comprises a polyamide resin comprising 100-60wt.% aromatic polyamide and 0-40wt.% aliphatic polyamide and a layered silicate having a cation exchange capacity of 30meq/100g or above. The layered silicate should be contained in an amount of 0.01-20wt.% in terms of an ash content, and at least 10% of the silicate should be dispersed at an interlayer distance of 50Åor above.
申请公布号 JPH08319417(A) 申请公布日期 1996.12.03
申请号 JP19950128327 申请日期 1995.05.26
申请人 MITSUBISHI CHEM CORP 发明人 KAWAI MICHIO;KAWA MANABU;KISHIMOTO SHINTARO
分类号 C08J5/18;C08G69/02;C08G69/04;C08G69/16;C08K3/34;C08K5/04;C08K5/17;C08K5/49;C08K9/02;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08J5/18
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