| 摘要 |
<p>The present invention provides a method for ablating material including directing a laser beam through a mask and through a scanning unit to an area of the material to thereby ablate the material, wherein the scanning unit can scan or be controlled to scan the beam in a predetermined pattern on the material, and an apparatus for laser ablation of material including a laser source for producing a beam of far ultra-violet or infra-red light, a mask, means for directing the beam through the mask and a computer-controlled scanning unit for scanning or being controlled to scan the beam in a predetermined pattern on the material, wherein the beam is directed to an area of the material to be ablated. The mask may be of variable area, and this area may be increased during a single use of the apparatus.</p> |
