发明名称 Determination of critical film thickness of a compound semiconductor layer, and a method for manufacturing a semiconductor device using the method of determination
摘要 By applying the method, the critical film thickness of a compound semiconductor layer is determined, and a semiconductor device having a compound semiconductor layer with an optimized film thickness excellent in emitting performance is manufactured. The relationship between film thickness of a compound semiconductor layer and photoluminescence (PL) corresponding to the film thickness is obtained by measurement, the film thickness where PL exhibits a peak is designated as critical film thickness. The semiconductor layer comprises II-VI group compound semiconductor layer containing at least cadmium. The relationship between the critical film thickness and cadmium composition ratio is obtained by measurement. An equation which approximates the relationship between the critical film thickness and cadmium composition ratio is formulated. When a semiconductor device is manufactured, a compound semiconductor layer is formed so as that the thickness of the layer is thinner than the critical film thickness determined from the equation.
申请公布号 US6024794(A) 申请公布日期 2000.02.15
申请号 US19970932869 申请日期 1997.09.18
申请人 SONY CORPORATION 发明人 TAMAMURA, KOSHI;TSUKAMOTO, HIRONORI;NAGAI, MASAHARU
分类号 C30B25/16;H01L21/66;H01L33/06;H01L33/28;H01L33/30;H01S5/00;(IPC1-7):C30B25/16 主分类号 C30B25/16
代理机构 代理人
主权项
地址