MANUFACTURING METHOD OF ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic circuit device, which can mount a semiconductor device on a mounting substrate so that anisotropic conducting film parts squeezed out from between the semiconductor device and the mounting substrate do not cross the upper surface of the unit when the unit is mounted on the substrate using an anisotropic conducting film. SOLUTION: An electronic circuit device is constituted in a structure that a mounting substrate 10 is held on a base stand P, an anisotropic conducting film 30 is provided on electrodes 11 on the surface on one side of the surfaces of the substrate 10, bumps 21 and the electrodes 11 are aligned with each other to place a semiconductor device 20 on the film 30, the device 20 and the film 30 are pressed and heated from the upper surface of the device 20 to make the bumps 21 and the electrodes 11 electrically connect with each other via the film 30 and the bumps 21 and the electrodes 11 are made to temporarily pressure bond. Then, anisotropic conducting film parts 30a squeezed out from between the device 20 and the substrate 10 are heated by a heating means H2 having a heating surface at least wide as much as the area of the parts 30a while the parts 30a are pressed by the means H2 from above to make the film 30 solidify and the device 20 is secured to the film 30.