发明名称 |
IMPROVED SENSITIVITY CAPACITIVE SENSOR |
摘要 |
<p>A method of creating an improved sensitivity capacitive fingerprint sensor involves forming vias from a first side of a sensor chip having an array of capacitive sensors, making the vias electronically conductive, and attaching a cover plate over the first side of the sensor chip spaced from the sensor chip by a distance of less than 25µm. An improved sensitivity capacitive fingerprint sensor has a capacitive sensor array including multiple sensor cells and electrically conductive, through-chip vias extending from connection points for sensor cell circuitry to a back side of the capacitive sensor array, a chip including active detection circuitry and electrical connection points, the electrical connection points being respectively connected to corresponding ones of the sensor cell circuitry connection points, and a cover plate, disposed above the sensor cells at a spacing of less that 25µm.</p> |
申请公布号 |
WO2008085771(A2) |
申请公布日期 |
2008.07.17 |
申请号 |
WO2007US89051 |
申请日期 |
2007.12.28 |
申请人 |
CUBIC WAFER, INC.;MISRA, ABHAY;TREZZA, JOHN |
发明人 |
MISRA, ABHAY;TREZZA, JOHN |
分类号 |
H01L21/82;G01R27/26 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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