| 摘要 |
PROBLEM TO BE SOLVED: To enable a resin layer to contain a large amount of inorganic powder by suppressing the formation of voids in a cured product layer to effectively restrict the flow of the resin layer when forming a laminate, and to more effectively reduce the heat resistance in a metal-based printed wiring board. SOLUTION: The thermosetting resin composition contains 60-90 wt.% inorganic powder consisting of 10-35 wt.% inorganic powder A having 0.1-0.9μm average particle diameter, 5-40 wt.% inorganic powder B having 2-6μm average particle diameter and 25-80 wt.% inorganic powder C having 10-30μm average particle diameter regulated so that the total proportion of the inorganic powders A, B and C may be 100 wt.%, wherein the ratios of the average particle diameters are within the ranges of from 0.035 to 0.055 in A/C, and of from 0.2 to 0.4 in B/C. The prepreg and the laminate are formed out of the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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