| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser-processed substrate manufacturing method capable of suppressing a deformation due to a thermal strain and a processed pattern in a laser-processed substrate.SOLUTION: In a group dispersion process, 60,000 processing holes h are dispersed at random into groups P1 to P9. At an area sorting step, when a first group P1 to a ninth group P9 are sorted by grids G or working areas E arranged on XY coordinates, the first group P1 to the nine groups P9 are sorted by a first grid G1 not offset, a second grid G2 offset in the X-coordinate, a third grid G3 offset in the X-coordinate and the Y-coordinate, and a fourth grid G4 offset in the Y-coordinate. At an assigning area deciding step, it is decided what of the sorted processing areas E each working hole h belongs to. At a laser processing step, the laser processing is performed on the basis of the positional information of the belonged processing hole h sequentially for each of the groups P1 to P9 and for each processing area E. |
