SILICON WAFER, METHOD FOR MANUFACTURING THE SAME, AND SOI WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a silicon wafer in which the surface roughness and the overall flatness of a wafer can be prevented from deteriorating, and to provide a silicon wafer manufactured by that method.

SOLUTION: The method for manufacturing a silicon wafer comprises a process for lapping with alkaline etching liquid wherein a loose abrasive having a maximum grain size of 21 μm or less and a mean grain size of 8.5 μm or less is employed, and an alkaline aqueous solution having the concentration of an alkaline component not lower than 50 wt.% is employed as the alkaline etching liquid in the etching process. A silicon wafer manufactured by that method is also included.

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