发明名称 LOW-TEMPERATURE MOLDING OF LAMINATED METALLIC PLATE
摘要 PURPOSE:To improve the molding property of a laminated metallic plate remarkably, by a method wherein the laminated metallic plate, constituted by pinching synthetic resin having an elongation larger than the same of a metal plate under a specified temperature range, between the metal plates, is cooled to a temperature within said range and is molded. CONSTITUTION:An adhesive strength under shearing between a skin metal plate and a synthetic resin of a laminated metallic plate, constituted by pinching the synthetic resin having an elongation larger than the same of the metal plate under a temperature range higher than -30 deg.C and lower than 0 deg.C, is improved as the temperature is lowered, therefore, the temperature range is specified below 0 deg.C in older to cool the laminated metallic plate to a temperature lower than a room temperature. However, when it is cooled to an excessively temperature, there is possibility of deterioration of elongation due to development of brittleness of the synthetic resin or deterioration in of secondary workability due to development of brittleness of the skin metal plate, therefore, the lower limit of the temperature is specified at -30 deg.C. The temperature control of the laminated metallic plate, which keeps the temperature of the laminated metallic plate within the range from 0 deg.C to -30 deg.C, may be achieved by cooling molding tools to a desired temperature and extracting heat from the tools upon working the laminated metallic plate.
申请公布号 JPS641522(A) 申请公布日期 1989.01.05
申请号 JP19870230548 申请日期 1987.09.14
申请人 NIPPON STEEL CORP 发明人 OGAMI TETSUO;EJIMA MIZUO
分类号 B21D22/20;B21D5/01;B29C51/14;B29C53/00;B29C67/00 主分类号 B21D22/20
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