发明名称 Verfahren zum Plattenpolieren und Vorrichtung dafür
摘要 Disclosed is a method for specular polishing the surface of a metal or non-metal plate (10) to be polished, especially a large-sized plate, in which the surface of the plate is polished by rotating a polishing member (9) via cranks (36, 37), while pressing the polishing member against the surface of the plate at a predetermined pressure. Since the polishing member is rotated via cranks, while being pressed against the surface of the plate at a predetermined pressure, the predetermined pressure is uniformly distributed over the entire surface to be polished, hence, precise and uniform specular polishing of even a large-sized plate is feasible. <IMAGE>
申请公布号 DE69313333(T2) 申请公布日期 1998.03.26
申请号 DE1993613333T 申请日期 1993.04.01
申请人 KANSAI PLANT INDUSTRY CO. LTD., HIGASHI, OSAKA, JP 发明人 YOSHIHARA, KAZUO, IKOMA-SHI, NARA-KEN, JP;JOJIMA, TADAMASA, NARA-KEN, JP;YOSHIHARA, NOBUO, NARA-SHI, NARA-KEN, JP;KAMON, MASATERU, OSAKA-FU, JP;YOSHIHARA, YOSHITO, HYOGO-KEN, JP;SAWADA, YASUHIRO, OSAKA-FU, JP;MORISHITA, KAZUO, HIGASHI-OSAKA-SHI, OSAKA-FU, JP;KURANO, TAMAKI, NABARI-SHI, MIE-KEN, JP
分类号 B24B7/19;B24B1/04;B24B29/00;B24B37/00;B24B37/005;B24B37/04;B24B37/07;B24B37/10;B24B41/047;(IPC1-7):B24B1/04 主分类号 B24B7/19
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