首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
REFLOW SOLDERING EQUIPMENT
摘要
申请公布号
JPH1093232(A)
申请公布日期
1998.04.10
申请号
JP19960240092
申请日期
1996.09.11
申请人
NIHON DENNETSU KK
发明人
SAITO HIROAKI
分类号
H05K3/34;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
您可能感兴趣的专利
REFERENCE LEVEL ADJUSTMENT CIRCUIT
ISDN TERMINAL EQUIPMENT
AIR-TIGHT PACKAGE FOR SURFACE MOUNT VIBRATOR
SEMICONDUCTOR DEVICE
SOLID-STATE IMAGE SENSING ELEMENT
TEST PATTERN SIGNAL GENERATOR
SURFACE ACOUSTIC WAVE CIRCUIT DEVICE
PACKAGE FOR CONTAINING ELECTRONIC COMPONENT
SEMICONDUCTOR BOARD TESTER
OUTPUT CONTROL DEVICE
RADIATION COOLING TYPE COLLECTOR BODY STRUCTURE FOR MICROWAVE TUBE
PERSONAL COMPUTER SYSTEM HAVING ALTERNATE- SYSTEM CONTROLLING APPARATUS
CONTROL METHOD FOR INDUSTRIAL ROBOT
ORIGINAL AREA DESIGNATION DEVICE
OUTPUT SIGNAL NOISE REDUCING CIRCUIT DEVICE FOR SEMICONDUCTOR MEMORY
CIRCUIT DIAGRAM INPUT DEVICE
ELECTROPHOTOGRAPHIC SENSITIVE BODY
FLYTENDE OLJERIGG MED KONTROLLERBAR HIVBEVEGELSE
AUTOMATIC TEST GENERATION FOR MODEL-BASED REAL-TIME FAULT DIAGNOSTIC SYSTEMS
METHOD AND APPARATUS FOR DYNAMIC AND INTERDEPENDENT PROCESSING OF INBOUND CALLS AND OUTBOUND CALLS
