Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups

摘要

Compositions(I), (II) and (III) comprising compounds having vinyl groups as side chains and epoxidized compositions(XI), (XII) and (XIII) thereof, which can be prepared by the various reaction combinations of (a) with (b) or (b)+(c), and or (d), are disclosed. (a) is at least one compound having at least one vinyl group and one epoxy group in the molecule; (b) is at least one of a polybasic compound, an anhydride thereof, a polymer having carboxylic groups at terminals and a polymer having carboxylic groups as side chains; (c) is at least one organic compound having at least one active hydrogen atom; and (d) is at least one of an unsaturated monocarboxylic compound or an unsaturated monocarboxylic ester having a hydroxyl group. Heat curable compositions and epoxy resin compositions can be made which comprise the above-mentioned compositions and a radical initiator or a curing agent, a polymer composition obtained by radically (co)polymerizing the compositions(III) or the epoxidized compositions(XIII) thereof. The epoxidized compositions(XI) and (XII) can provide a coating layer or a formed article having excellent properties such as heat resistance, outdoor durability and further electric properties.