发明名称 CARRIER FOR FLEXIBLE CIRCUIT BOARD, AND SOLDERING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To reduce thermal capacity by bonding a magnet member to one of a pair of frame-like boards for clamping the opposite sides of a flexible circuit board at the outer circumferential part thereof. SOLUTION: A supporting board 12a and a holding board 12b are formed in substantially identical shape and the rectangular inside diameter located on the central side is set substantially equal to or slightly larger than a machining region 11a, e.g. a soldering part, of a flexible circuit board 11 shown by cross hatching. A plurality of magnet members 13 are bonded to the upper surface of the supporting board 12a while holding the opposite sides of the flexible circuit board 11 at the outer circumferential part thereof between the supporting board 12a and the holding board 12b thus holding the holding board 12b on the supporting board 12a by means of each magnet member 13. According to the method, respective boards 12a, 12b can be fixed/removed easily while reducing thermal capacity required for heating.
申请公布号 JP2000183593(A) 申请公布日期 2000.06.30
申请号 JP19980357385 申请日期 1998.12.16
申请人 OPTREX CORP;MITSUBISHI ELECTRIC CORP;NIPPON SEIKI CO LTD 发明人 TAKAHIRA HIROSHI;HAMAGUCHI TSUNEO;TAKAHASHI KENICHI
分类号 B23K1/00;B23K1/008;H05K3/34;H05K13/02 主分类号 B23K1/00
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