ELECTROCONDUCTIVE METAL PASTE AND METHOD FOR PRODUCTION THEREOF

摘要

[purpose] The provision of an electroconductive metal paste of low temperature sintering type for use in printing a high density circuit, which exhibits good adhesion and a smooth surface when applied on a substrate and burned, and thus can be used for forming a fine circuit exhibiting a low resistance. [constitution] An electroconductive metal paste which comprises a resin composition comprising a thermosetting resin component, an organic acid anhydride or a derivative thereof or an organic acid, and one or more organic solvents and, dispersed homogeneously therein, as an electroconductive medium, ultra-fine metal particles having an average particle diameter of 100 nm or less and being surface-coated with one or more compounds having a group capable of forming a coordinate-type bonding with a metal element contained in said ultra-fine metal particle through a lone electron pair of N, O or S, optionally in combination with a metal filler having an average particle diameter of 0.5 to 20 mu m. The electroconductive metal paste can undergo low temperature sintering between ultra-fine metal particles contained therein when the paste is subjected to a low temperature heat treatment.