发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To solve the problem that a method performed by irradiating laser beams is mentioned as a method for crystallizing a semiconductor film, but when laser beams are irradiated on the semiconductor film, the semiconductor film is instantaneously melted and partly expanded, or as a temperature gradient of a substrate and the semiconductor film is steep, the semiconductor film is distorted and the quality of the resulting crystalline semiconductor film is reduced. SOLUTION: After being crystallized with laser beams with respect to a semiconductor film, the semiconductor film is heated by a heat treatment, so that a distortion of the semiconductor film is decreased. Irradiation with the laser beams causes partial heating, while the heat treatment wholly heats the substrate and the semiconductor film. Thus, a distortion formed in the semiconductor film is decreased and physical properties of the semiconductor film can be raised.</p>
申请公布号 JP2002329668(A) 申请公布日期 2002.11.15
申请号 JP20020048755 申请日期 2002.02.25
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;MITSUKI TORU;TAKANO YOSHIE
分类号 G02F1/1368;H01L21/20;H01L21/26;H01L21/268;H01L21/324;H01L21/336;H01L29/786;(IPC1-7):H01L21/20;G02F1/136 主分类号 G02F1/1368
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