| 摘要 |
PROBLEM TO BE SOLVED: To solder precisely a plurality of electronic components different in size to footprints, regarding the structure of footprints which are formed on a printed wiring board in order to solder electrodes of electronic components. SOLUTION: A first footprint and a second footprint are formed on the printed wiring board facing each other at an interval. A first electrode formed on one side of an electronic component is soldered to the first footprint. A second electrode formed on the other side of the electronic component is soldered to the second footprint. In the footprint structure of the printed wiring board, a plurality of footprint parts are formed adjacently toward the facing direction in the first and second footprints. The width of the footprints is made smaller sequentially toward the facing direction.
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