| 摘要 |
<p>A coating liquid spraying apparatus and semiconductor manufacturing equipment having the same are provided to consistently maintain a shape of coating liquid, even if a flow rate of the coating liquid is reduced, using a spray nozzle tip with a smaller inner diameter. A coating liquid spraying apparatus includes a coating liquid supply line(13), a spray nozzle(11), and a spray nozzle tip(12). A coating liquid is supplied through the coating liquid supply line. The spray nozzle is installed to an end of the coating liquid supply line, and has a first inner diameter(D11). The spray nozzle tip is installed to an end of the spray nozzle to spray the coating liquid onto a wafer, and has a second inner diameter(D12). The second inner diameter is equal to or less than one third of the first inner diameter, and ranges about 1.0 to 1.4 mm. The coating liquid is photoresist. Semiconductor manufacturing equipment includes a rotating chuck for rotating a wafer, a preventive coating liquid spraying apparatus, and a bowl for preventing the coating liquid sprayed onto the wafer from being scattered by the rotation of the wafer.</p> |
