发明名称 |
Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface |
摘要 |
A semiconductor device including a first semiconductor chip, a second semiconductor chip bonded to the first semiconductor chip in a stacked relation, and a registration structure which causes the first and second semiconductor chips to be positioned with respect to each other by depression-projection engagement therebetween. The registration structure includes, for example, a registration recess provided on a surface of the first semiconductor chip, and a registration projection provided on a surface of the second semiconductor chip for engagement with the registration recess. The registration projection may be a spherical member provided on the surface of the second semiconductor chip. |
申请公布号 |
US7307349(B2) |
申请公布日期 |
2007.12.11 |
申请号 |
US20050150129 |
申请日期 |
2005.06.13 |
申请人 |
ROHM CO., LTD. |
发明人 |
HIKITA JUNICHI;NAKAGAWA YOSHIKAZU;YAMAMOTO KOJI |
分类号 |
H01L23/52;H01L21/56;H01L21/60;H01L21/98;H01L23/31;H01L23/36;H01L23/48;H01L23/485;H01L23/498;H01L25/065;H01L29/06 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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