Method of manufacturing LED module

摘要

The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.

主权项

1. A method of manufacturing a light emitting diode (LED) module comprising the steps of:
arranging a plurality of electrode plates to face each other on a horizontal surface, the electrode plates being electrically separated and respectively forming a positive electrode and a negative electrode so that electrically separated areas among an entire area have a minimum area, stacking insulation layers to cover top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and directly grounding both electrodes of LED chips to the ground holes which expose the electrically separated electrode plates, arranging the electrode plates to have a zigzag shape on said horizontal surface so that electrically separated portions are arranged to be close to and face each other providing a terminal at one end of each of the electrode plates, and forming a connector at one or more of the terminals, said connector including an edge connection surface which is bent and a cut portion having a center connection surface to form an LED module, said connector for directly connecting said LED module to a second LED module.