CO-CROSSLINKING AGENT SYSTEM FOR ENCAPSULATION FILM CONTAINING (METH)ACRYLAMIDE COMPOUND

摘要

PROBLEM TO BE SOLVED: To provide novel compositions which can be used for manufacturing films having maximum specific resistance ρ and are suitable for encapsulation of electronic devices.SOLUTION: The problem is solved by a composition (Z) containing (i) at least one kind of compound (I) selected from a group consisting of triallyl isocyanurate and triallyl cyanurate and (ii) at least one kind of compound represented by chemical structural formula (II).SELECTED DRAWING: None