发明名称 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
摘要 Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens.
申请公布号 US9409207(B2) 申请公布日期 2016.08.09
申请号 US201414164680 申请日期 2014.01.27
申请人 Seiko Epson Corporation 发明人 Onishi Yasunori
分类号 B06B3/04;B06B1/06;G01N29/06;B06B3/00;G10K11/30 主分类号 B06B3/04
代理机构 Global IP Counselors, LLP 代理人 Global IP Counselors, LLP
主权项 1. An ultrasonic device comprising: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body and perform at least one of transmission and reception of ultrasound; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate, the acoustic lens having a lens portion that focuses the ultrasound; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate.
地址 Tokyo JP