发明名称 |
Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus |
摘要 |
Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens. |
申请公布号 |
US9409207(B2) |
申请公布日期 |
2016.08.09 |
申请号 |
US201414164680 |
申请日期 |
2014.01.27 |
申请人 |
Seiko Epson Corporation |
发明人 |
Onishi Yasunori |
分类号 |
B06B3/04;B06B1/06;G01N29/06;B06B3/00;G10K11/30 |
主分类号 |
B06B3/04 |
代理机构 |
Global IP Counselors, LLP |
代理人 |
Global IP Counselors, LLP |
主权项 |
1. An ultrasonic device comprising:
an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body and perform at least one of transmission and reception of ultrasound; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate, the acoustic lens having a lens portion that focuses the ultrasound; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. |
地址 |
Tokyo JP |