发明名称 MICROFUSED SILICON STRAIN GAUGE (MSG) PRESSURE SENSOR PACKAGE
摘要 The present invention provides a method and an apparatus related to a microfused silicon strain gauge (MSG) pressure sensor. According to the present invention, a pressure sensor package comprises: a sensing element configured to be exposed to a pressure environment and having at least one strain gauge; an electronic package disposed on a carrier and electrically coupled to the sensing element, wherein the carrier is disposed on a port having the sensing element and the port can reduce a sealing force in an axial direction, a decoupling feature related to the accompanying sealing force, and the length of the port; a housing disposed near the sensing element and the electronic package; and a connector connected to the housing, electrically connected to the electronic package, and having an external interface.
申请公布号 KR20160104551(A) 申请公布日期 2016.09.05
申请号 KR20160016376 申请日期 2016.02.12
申请人 SENSATA TECHNOLOGIES, INC. 发明人 SCHOOT UITERKAMP ERNIE JOHANNUS ANTONIUS;WIERSMA DEDDE HEDZER;JACOBS FRANK HENDRI
分类号 G01D11/00;G01B5/30;G01D11/24;G01L5/22 主分类号 G01D11/00
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