发明名称 |
MICROFUSED SILICON STRAIN GAUGE (MSG) PRESSURE SENSOR PACKAGE |
摘要 |
The present invention provides a method and an apparatus related to a microfused silicon strain gauge (MSG) pressure sensor. According to the present invention, a pressure sensor package comprises: a sensing element configured to be exposed to a pressure environment and having at least one strain gauge; an electronic package disposed on a carrier and electrically coupled to the sensing element, wherein the carrier is disposed on a port having the sensing element and the port can reduce a sealing force in an axial direction, a decoupling feature related to the accompanying sealing force, and the length of the port; a housing disposed near the sensing element and the electronic package; and a connector connected to the housing, electrically connected to the electronic package, and having an external interface. |
申请公布号 |
KR20160104551(A) |
申请公布日期 |
2016.09.05 |
申请号 |
KR20160016376 |
申请日期 |
2016.02.12 |
申请人 |
SENSATA TECHNOLOGIES, INC. |
发明人 |
SCHOOT UITERKAMP ERNIE JOHANNUS ANTONIUS;WIERSMA DEDDE HEDZER;JACOBS FRANK HENDRI |
分类号 |
G01D11/00;G01B5/30;G01D11/24;G01L5/22 |
主分类号 |
G01D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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