发明名称 Electric discharge machining die sinking device and related method of operation
摘要 Systems and methods for controlled and precise EDM manufacturing of a component are disclosed. In one embodiment, a system includes: a tank for holding a fluid; a first electrode array in the tank, the first electrode array including a plurality of electrodes configured to shape a workpiece; a workpiece fixture for positioning the workpiece at least partially immersed in the fluid and proximate the first electrode array; a pulse generator for creating an electric discharge between the workpiece and the first electrode array to remove material from the workpiece; a gap sensing circuit communicatively connected to the workpiece and the first electrode array, the gap sensing circuit configured to monitor the electric discharge between the workpiece and the first electrode array; and a computing device communicatively connected to the gap sensing circuit and the workpiece fixture, the computing device manipulating a position of the workpiece in the tank relative the first electrode array based upon data obtained from the gap sensing circuit.
申请公布号 US9452483(B2) 申请公布日期 2016.09.27
申请号 US201213676254 申请日期 2012.11.14
申请人 General Electric Company 发明人 Luo Yuefeng;Adis William Edward;Jones Michael Lewis
分类号 B23H1/02;B23H9/10 主分类号 B23H1/02
代理机构 Hoffman Warnick LLC 代理人 Hoffman Warnick LLC ;Cusick Ernest G.
主权项 1. An electric discharge machining (EDM) die sinking device comprising: a tank for holding a fluid; a first electrode array in the tank, the first electrode array including a plurality of electrode segments, each of the plurality of segments being electrically insulated from other electrode segments of the plurality of electrode segments, wherein the plurality of electrode segments are configured to shape a workpiece; a workpiece fixture for positioning the workpiece at least partially immersed in the fluid and proximate the first electrode array; a pulse generator for creating an electric discharge between the workpiece and the first electrode array to remove material from the workpiece; a gap sensing circuit communicatively connected to the workpiece and the first electrode array, the gap sensing circuit configured to monitor the electric discharge between the workpiece and the first electrode array; and a computing device communicatively connected to the gap sensing circuit and the workpiece fixture, for communication, the computing device manipulating a position of the workpiece in the tank relative the first electrode array based upon data obtained from the gap sensing circuit.
地址 Schenectady NY US