发明名称 |
ELECTRICALLY INSULATING RESIN COMPOSITION AND LAMINATE SHEET |
摘要 |
The present invention provides an electrically insulating resin composition comprising a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, wherein the proportion of the polyamide resin is 1 to 45% by mass. The present invention also provides a laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed therebetween, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in the molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass. |
申请公布号 |
US2016303821(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201615191683 |
申请日期 |
2016.06.24 |
申请人 |
NITTO SHINKO CORPORATION ;NITTO DENKO CORPORATION |
发明人 |
KIHARA Yasuyuki;TAMAI Akira;UKEI Hiroichi;KASAGI Tomoyuki;YAMAMOTO Mizuki |
分类号 |
B32B5/02;C08J5/18;H01B3/30;B32B27/12;B32B27/28;B32B27/34;C08L81/06;B32B27/08 |
主分类号 |
B32B5/02 |
代理机构 |
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代理人 |
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主权项 |
1. A laminate sheet obtained by bonding a plurality of sheet materials with a resin composition layer interposed between the sheet materials, wherein the resin composition layer comprises a polysulfone resin including a plurality of sulfonyl groups in a molecule and a polyamide resin, and the proportion of the polyamide resin is 1 to 45% by mass. |
地址 |
Sakai-shi JP |