FOCAL PLANE ARRAYS WITH BACKSIDE CONTACTS

摘要

A package assembly includes a package body and a focal plane array (FPA) within the package body. The FPA includes a read out integrated circuit (ROIC) having a circuit side. A photodiode array (PDA) defines an optical axis and has a backside electrically connected to the circuit side of the ROIC. A plurality of conductive through-vias extend from the circuit side of the ROIC through to input/output (I/O) bondpads on the backside of the ROIC. A window is operatively connected between the FPA and the package body.

主权项

1. A focal plane array (FPA) comprising:
a read out integrated circuit (ROIC) having a circuit side; a photodiode array (PDA) defining an optical axis having a backside electrically connected to the circuit side of the ROIC; and a plurality of conductive through-vias extending from the circuit side of the ROIC through to I/O bondpads on the backside of the ROIC.