| 摘要 |
A PCMCIA card manufacturing process is disclosed, including the steps of (1) providing a top cover and a bottom cover made of a metal, preferably stainless steel, each of the top cover and bottom cover being provided with a plurality of hooks along two opposite lateral edges, (2) placing the top cover and bottom cover respectively into a first mold and a second mode for injection molding a first frame member on the top cover with the hooks of the top cover embedded in the first frame member and a second frame member on the bottom cover with the hooks of the bottom cover embedded in the second frame member, each of the first and second frame member being provided with at least one notch that match each other to define at least a connector slot, (3) disposing a circuit board between the first and second frame members with the connector thereof received within the connector slot, and (4) jointing the first and second members together, preferably by ultra sonic welding.
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