发明名称 WIRE SAW
摘要 PROBLEM TO BE SOLVED: To provide a wire saw with simple structure and a compact form. SOLUTION: This wire saw 10 forms a wire train between a pair of rollers with groove 14 and 16 by extending numerous lines of wires 24, 24... fixing abrasive rains on the surfaces, only by the pair of rollers with groove 14 and 16. And the wire saw 10 runs the wire train by driving to rotate the pair of rollers 14 and 16, and by pressing and connecting a semiconductive ingot 26 to the wire train, the semiconductive ingot 26 is cut into numerous wafers.
申请公布号 JPH10337648(A) 申请公布日期 1998.12.22
申请号 JP19970146823 申请日期 1997.06.04
申请人 TOKYO SEIMITSU CO LTD 发明人 TSUKADA SHUICHI;MIZUNO YASUO
分类号 B24B27/06;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
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