| 摘要 |
PROBLEM TO BE SOLVED: To provide high reliability soldering connection even if voids and excess solder leakage occur at a solder heating time. SOLUTION: Through means 40 are formed in the thickness direction in a lead terminal 22 to be soldered to the mating circuit board by a batch solder constant heat method or a batch solder pulse heat method. Voids and excess solder occurred at a solder heating time get out to the surface side of the lead terminal 22 through the through means 40. |
