发明名称 HOT MELT ADHESIVE COMPOSITIONS
摘要 <p>A hot-melt adhesive composition comprises 100 parts by weight of a tackifier (B), and 1 to 900 parts by weight of an alpha -olefin/aromatic vinyl compound random copolymer (C). A hot-melt adhesive composition comprises 100 parts by weight of a base polymer (A), 1 to 900 parts by weight of component (B), and 1 to 1,000 parts by weight of component (C). A hot-melt adhesive composition comprises 100 parts by weight of component (A), 10 to 300 parts by weight of component (B), and 10 to 400 parts by weight of component (C). The component (A) is preferably at least one polymer selected from the group consisting of a polyolefin (a-1), a polar group containing polymer (a-2) and an aromatic vinyl compound/conjugated diene copolymer (a-3). These hot-melt adhesive compositions exhibit excellent adhesive strength and can be used as an adhesive for styrene resins.</p>
申请公布号 EP0957147(A1) 申请公布日期 1999.11.17
申请号 EP19980900677 申请日期 1998.01.21
申请人 MITSUI CHEMICALS, INC. 发明人 MORIZONO, KENICHI;OKADA, KEIJI;TOKITA, SUGURU
分类号 C08L23/02;C08L23/06;C08L23/08;C08L53/02;C08L91/06;C09J109/06;C09J123/08;C09J125/02;C09J125/08;C09J151/06;C09J153/00;C09J153/02;(IPC1-7):C09J123/00;C09J201/00;C09J125/00 主分类号 C08L23/02
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