发明名称 MOLD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
摘要 To produce a metal case (20) having regular perforations (21) for an electronic device, a metal mold (30) includes pins (36) provided on its cope (31) or drag (32). The pins (36) are arranged in such a manner that the line connecting two adjacent pins is not perpendicular to the flow of molten metal that is introduced through a cavity (35) in the mold (30).
申请公布号 WO9967044(A1) 申请公布日期 1999.12.29
申请号 WO1999JP03238 申请日期 1999.06.17
申请人 KABUSHIKI KAISHA TOSHIBA;TSUKUBA DIECASTING CO., LTD.;HOSOI, TAKASHI;TAKAKI, NOBUYUKI;ONO, YASUO;KIUCHI, MIKIO 发明人 HOSOI, TAKASHI;TAKAKI, NOBUYUKI;ONO, YASUO;KIUCHI, MIKIO
分类号 B22D17/00;B22C9/06;B22D17/22;(IPC1-7):B22C9/06 主分类号 B22D17/00
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